Open AccessAn in situ method for characterizing the kinetics of the oxidation process of copper thin films via sheet resistance
Author(s) -
Yan Luo,
Cheng Zhong,
Zhang Li,
Yan Xue-jian,
Jin Li,
Yiming Jiang
Publication year - 2007
Publication title -
wuli xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.199
H-Index - 47
ISSN - 1000-3290
DOI - 10.7498/aps.56.6722
Subject(s) - copper , kinetics , materials science , thin film , sheet resistance , in situ , substrate (aquarium) , deposition (geology) , process (computing) , composite material , chemical engineering , metallurgy , nanotechnology , chemistry , layer (electronics) , computer science , organic chemistry , paleontology , physics , oceanography , quantum mechanics , sediment , geology , engineering , biology , operating system
In this paper, a new in situ method was developed for characterizing the kinetics of the oxidation process of copper thin films by using sheet resistance. Copper thin films were prepared on glass substrate by vacuum deposition. The oxidation kinetics of the copper thin films was studied via sheet resistance which increased during the process. The results suggested that this new method can be applied to the characterization of the reaction kinetics of copper thin film.