Study on the microstructure and properties of (Ti, Al)N film deposited by pulsed high energy density plasma
Author(s) -
Liu Yuan-Fu,
Han Jian-min,
Guling Zhang,
Jiuli Wang,
Guangliang Chen,
Xueming Li,
Wenran Feng,
Songhua Fan,
Chizi Liu,
Size Yang
Publication year - 2005
Publication title -
acta physica sinica
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.199
H-Index - 47
ISSN - 1000-3290
DOI - 10.7498/aps.54.1301
Subject(s) - materials science , microstructure , nanoindentation , corrosion , x ray photoelectron spectroscopy , plasma , substrate (aquarium) , polarization (electrochemistry) , metallurgy , thin film , composite material , chemical engineering , nanotechnology , physics , oceanography , chemistry , quantum mechanics , engineering , geology
Hard and corrosion resistance (Ti, Al)N film was deposited by pulsed high energy density plasma on the substrate of 045% C carbon steel at ambient temperature. The microstructure of the film has been investigated by SEM,XRD,XPS and AES. The nanohardness of the film was tested by nanoindentation tester. The corrosion resistance of the film was tested by potentiodynamic polarization in 05 mol /L H2SO4 aqueous solution. The results indicate that the film mainly composed of (Ti, Al)N and a small amount of AlN. The nanohardness of the film approaches 26 GPa. The corrosion resistance of the film is improved by about one order of magnitude, compared with 1Cr18Ni9Ti austenitic stainless steel.
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