Open AccessTHE GROWTH CHARACTER AND ADHESION OF CUBIC BORON NITRIDE THIN FILMS
Author(s) -
Xingming Ma,
Yue Jin-Shun,
Deyan He,
Guanghua Chen
Publication year - 1998
Publication title -
wuli xuebao
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.199
H-Index - 47
ISSN - 1000-3290
DOI - 10.7498/aps.47.871
Subject(s) - materials science , x ray photoelectron spectroscopy , thin film , boron nitride , scanning electron microscope , substrate (aquarium) , chemical vapor deposition , silicon , carbon film , boron , adhesion , chemical engineering , sputtering , silicon nitride , nitride , analytical chemistry (journal) , composite material , nanotechnology , metallurgy , layer (electronics) , chemistry , oceanography , organic chemistry , chromatography , geology , engineering
Cubic boron nitride (c-BN) thin films were deposited on silicon,nickel,stainless steel and Ni-coated silicon substrates by hot filament enhanced plasma chemical vapor deposition (CVD).The films were characterized by infrared spectroscopy(IR), X-ray diffraction, scanning electron microscopy(SEM),and X-ray photoelectron spectra(XPS).It was found that the quality of c-BN thin films varied with deposition conditions and substrates.Under optimum conditions,thin films with high percentage of c-BN and good adhesion were deposited on Ni substrate.When sputtering a Ni interlayer on Si substrate prior to the growth,the c-BN content of the films increased and an excellent adhesion was obtained.