Open AccessDevelopment of a 1.5 GPa Grade Sideouter through Hot-stamping Process
Author(s) -
HyunChul Lee,
Min-geun Kim,
Gun-yung Go,
Seung-youn Park,
Seung-nam Han
Publication year - 2019
Publication title -
transactions of korean society of automotive engineers
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.206
H-Index - 5
eISSN - 2234-0149
pISSN - 1225-6382
DOI - 10.7467/ksae.2019.27.3.193
Subject(s) - hot stamping , process (computing) , materials science , manufacturing engineering , engineering drawing , metallurgy , computer science , engineering , programming language
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