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Strength Evaluation of Pb-free Solder Joints with Artificial Aging Time and Test Temperature
Author(s) -
Soyoung Park,
Seung Min Yang,
Hui Yu
Publication year - 2014
Publication title -
han'gug jadongca gonghaghoe nonmunjib/han-guk jadongcha gonghakoe nonmunjip
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.206
H-Index - 5
eISSN - 2234-0149
pISSN - 1225-6382
DOI - 10.7467/ksae.2014.22.3.090
Subject(s) - soldering , materials science , melting temperature , shear strength (soil) , melting point , direct shear test , metallurgy , composite material , shear (geology) , environmental science , soil science , soil water

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