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Effect of the Prior Microstructure Degradation on the High Temperature/Low Stress Non-isothermal Creep Behavior of CMSX-4® Ni-based Single Crystal Superalloy
Author(s) -
R. Giraud,
J. Cormier,
Z. Hervier,
D. Bertheau,
K. Harris,
J. Wahl,
X. Milhet,
J. Mendez,
A. Organista
Publication year - 2012
Language(s) - English
Resource type - Conference proceedings
DOI - 10.7449/2012/superalloys_2012_265_274
Subject(s) - superalloy , materials science , creep , microstructure , isothermal process , degradation (telecommunications) , stress (linguistics) , single crystal , metallurgy , crystallography , thermodynamics , electronic engineering , chemistry , physics , linguistics , philosophy , engineering

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