Open AccessA Prediction of Wafer Yield Using Product Fabrication Virtual Metrology Process Parameters in Semiconductor Manufacturing
Author(s) -
Wan Sik Nam,
Seoung Bum Kim
Publication year - 2015
Publication title -
daehan san'eob gonghag hoeji/daehan saneop gonghak hoeji
Language(s) - English
Resource type - Journals
eISSN - 2234-6457
pISSN - 1225-0988
DOI - 10.7232/jkiie.2015.41.6.572
Subject(s) - semiconductor device fabrication , wafer , metrology , semiconductor device modeling , wafer fabrication , process (computing) , semiconductor , yield (engineering) , reliability engineering , semiconductor industry , semiconductor device , product (mathematics) , manufacturing engineering , computer science , process engineering , engineering , electronic engineering , materials science , nanotechnology , electrical engineering , mathematics , statistics , cmos , geometry , layer (electronics) , metallurgy , operating system