Autograph Assisted Mathematics Module Development to Improve Problem Solving Abilities and Mathematic Connection of High School Students | Zendy

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Autograph Assisted Mathematics Module Development to Improve Problem Solving Abilities and Mathematic Connection of High School Students

Author(s) -

Dewi Anggraini,

Edi Syahputra,

Waminton Rajagukguk

Publication year - 2020

Publication title -

journal of education and practice

Language(s) - English

Resource type - Journals

ISSN - 2520-467X

DOI - 10.7176/jep/11-35-02

Subject(s) - autograph , connection (principal bundle) , mathematics education , computer science , algebra over a field , mathematics , pure mathematics , geometry , art , art history

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