Open AccessNumerical Fatigue Life Prediction of IGBT Module for Electronic Locomotive
Author(s) -
Oh Young Kwon,
Young Moon Jang,
YoungHo Lee,
SungHoon Choa
Publication year - 2017
Publication title -
journal of the microelectronics and packaging society
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2017.24.1.103
Subject(s) - materials science , ribbon , composite material , soldering , wire bonding , dbc , copper , insulated gate bipolar transistor , stress (linguistics) , lead frame , metallurgy , electrical engineering , chip , voltage , optoelectronics , semiconductor device , engineering , cmos , linguistics , philosophy , layer (electronics)
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom