Open AccessStudy of high Speed Laser Cutting of LED Module
Author(s) -
Won Yong Choi,
SungHoon Choa
Publication year - 2017
Publication title -
journal of the microelectronics and packaging society
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2017.24.1.091
Subject(s) - wafer dicing , materials science , ceramic , laser , surface roughness , laser cutting , composite material , substrate (aquarium) , surface finish , copper , silicone , metallurgy , optics , oceanography , physics , layer (electronics) , geology
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