Open AccessKinetic Analyses on Thermal Degradation of Epoxy Based Adhesive for Packaging Application
Author(s) -
Yeong K. Kim,
Yoon Sun Lee
Publication year - 2017
Publication title -
maikeuro jeonja mit paekijing hakoeji/ma'ikeu'ro jeonja mic pae'kijing haghoeji
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2017.24.1.067
Subject(s) - thermogravimetry , activation energy , epoxy , arrhenius equation , degradation (telecommunications) , materials science , adhesive , exponential function , thermodynamics , kinetics , thermal , composite material , kinetic energy , thermal analysis , analytical chemistry (journal) , chemistry , mathematics , organic chemistry , computer science , physics , inorganic chemistry , telecommunications , mathematical analysis , layer (electronics) , quantum mechanics