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Trasient Liquid Phase bonding for Power Semiconductor
Author(s) -
MyongHoon Roh,
Hiroshi Nishikawa,
Jae Pil Jung,
wonjoong kim
Publication year - 2017
Publication title -
journal of the microelectronics and packaging society
Language(s) - Uncategorized
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2017.24.1.027
Subject(s) - semiconductor , phase (matter) , materials science , power (physics) , liquid phase , engineering physics , optoelectronics , engineering , physics , thermodynamics , quantum mechanics

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