Open AccessTransient Liquid Phase (TLP) Bonding of Device for High Temperature Operation
Author(s) -
Do-Hyun Jung,
Myung-Hwan Roh,
Jun-hyeong Lee,
Kyung-heum Kim,
Jae Pil Jung
Publication year - 2017
Publication title -
journal of the microelectronics and packaging society
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2017.24.1.017
Subject(s) - materials science , soldering , semiconductor , transient (computer programming) , anodic bonding , junction temperature , liquid phase , phase (matter) , power module , semiconductor device , power semiconductor device , layer (electronics) , power (physics) , optoelectronics , electrical engineering , computer science , composite material , engineering , voltage , chemistry , physics , organic chemistry , quantum mechanics , thermodynamics , operating system
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