A Study on Fabrication of Hydrophobic Modification on the Surface of Copper using 355nm-Pulsed Laser
Author(s) -
Dan Hee Yun,
Bo Seok Kang,
Jeon Han Park,
Cheng Yeol Gwak,
Bo Sung Shin
Publication year - 2016
Publication title -
journal of the microelectronics and packaging society
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2016.23.4.101
Subject(s) - contact angle , materials science , fabrication , copper , wetting , surface modification , surface roughness , laser , irradiation , polymer , microstructure , surface finish , nanostructure , metal , composite material , chemical engineering , nanotechnology , optics , metallurgy , medicine , alternative medicine , physics , pathology , nuclear physics , engineering
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