Open AccessEffect of CNT-Ag Composite Pad on the Contact Resistance of Flip-Chip Joints Processed with Cu/Au Bumps
Author(s) -
Jung-Yeol Choi,
Tae Sung Oh
Publication year - 2015
Publication title -
journal of the microelectronics and packaging society
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2015.22.3.039
Subject(s) - flip chip , composite number , materials science , composite material , omega , contact resistance , adhesive , layer (electronics) , physics , quantum mechanics
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