Open AccessWettability of SAC305-coated Cu Fabricated by Low Temperature Process Using Ultrafine SAC305 Nanoparticles
Author(s) -
Yong Moo Shin,
Tae Jong Choi,
Kyung Jin Cho,
Seok Pil Jang,
JongHyun Lee
Publication year - 2015
Publication title -
journal of the microelectronics and packaging society
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2015.22.3.025
Subject(s) - materials science , wetting , contact angle , intermetallic , composite material , layer (electronics) , surface roughness , copper , nanometre , metallurgy , alloy
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