Open AccessEffects of Sputtering Conditions of TiW Under Bump Metallurgy on Adhesion Strength of Au Bump Formed on Al and SiN Films
Author(s) -
Yang-Geun Jo,
Sang-Hee Lee,
Ji-Mook Kim,
HyunSik Kim,
HoJung Chang
Publication year - 2015
Publication title -
journal of the microelectronics and packaging society
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2015.22.3.019
Subject(s) - sputtering , wafer , materials science , metallurgy , composite material , optoelectronics , thin film , nanotechnology
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