Open AccessEffects of Sputtering Conditions of TiW Under Bump Metallurgy on Adhesion Strength of Au Bump Formed on Al and SiN Films
Author(s) -
Yang-Geun Jo,
SangHee Lee,
Ji-Mook Kim,
Hyun-Sik Kim,
Hyo Sik Chang
Publication year - 2015
Publication title -
maikeuro jeonja mit paekijing hakoeji/ma'ikeu'ro jeonja mic pae'kijing haghoeji
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2015.22.3.019
Subject(s) - sputtering , wafer , materials science , metallurgy , composite material , optoelectronics , thin film , nanotechnology