Open AccessPast and Present Research Topics within the Korean Micoelectronics and Packaging Using Social Network Analysis
Author(s) -
Hyunjoung Lee,
Il Sohn
Publication year - 2015
Publication title -
journal of the microelectronics and packaging society
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2015.22.3.009
Subject(s) - ball grid array , microelectronics , flip chip , centrality , electronics , reliability (semiconductor) , computer science , engineering physics , data science , engineering , materials science , electrical engineering , nanotechnology , soldering , physics , power (physics) , adhesive , mathematics , layer (electronics) , combinatorics , quantum mechanics , composite material
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