Open AccessNovel Low-Volume Solder-on-Pad Process for Fine Pitch Cu Pillar Bump Interconnection
Author(s) -
HyunCheol Bae,
Haksun Lee,
YongSung Eom,
KwangSeong Choi
Publication year - 2015
Publication title -
journal of the microelectronics and packaging society
Language(s) - Uncategorized
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2015.22.2.055
Subject(s) - interconnection , pillar , materials science , soldering , volume (thermodynamics) , process (computing) , composite material , optoelectronics , computer science , structural engineering , engineering , telecommunications , physics , operating system , quantum mechanics
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom