Open AccessFabrication for Optical Layer and Packaging Technology of Optical PCB
Author(s) -
Tae-Hoon Kim,
Seok-Hwan Huh,
Myung Yung Jeong
Publication year - 2015
Publication title -
maikeuro jeonja mit paekijing hakoeji/ma'ikeu'ro jeonja mic pae'kijing haghoeji
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2015.22.1.001
Subject(s) - interconnection , fabrication , materials science , lithography , layer (electronics) , optoelectronics , process (computing) , transmission (telecommunications) , thermal , electronic engineering , computer science , nanotechnology , engineering , telecommunications , medicine , alternative medicine , pathology , meteorology , operating system , physics