Open AccessFabrication for Optical Layer and Packaging Technology of Optical PCB
Author(s) -
Taehoon Kim,
SeokHwan Huh,
Myung Yung Jeong
Publication year - 2015
Publication title -
journal of the microelectronics and packaging society
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2015.22.1.001
Subject(s) - interconnection , fabrication , materials science , lithography , layer (electronics) , optoelectronics , process (computing) , transmission (telecommunications) , thermal , electronic engineering , computer science , nanotechnology , engineering , telecommunications , medicine , alternative medicine , pathology , meteorology , operating system , physics
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