Open AccessCu-Filling Behavior in TSV with Positions in Wafer Level
Author(s) -
Soon-Jae Lee,
Young-Joo Jang,
Jun-Hyeong Lee,
Jae Pil Jung
Publication year - 2014
Publication title -
journal of the microelectronics and packaging society
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2014.21.4.091
Subject(s) - wafer , through silicon via , materials science , silicon , stack (abstract data type) , anode , plating (geology) , cathode , electrode , substrate (aquarium) , composite material , optoelectronics , electrical engineering , chemistry , oceanography , engineering , geophysics , computer science , programming language , geology
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