Open AccessFour Point Bending Test for Adhesion Testing of Packaging Strictures: A Review
Author(s) -
Kenny Mahan,
Bongtae Han
Publication year - 2014
Publication title -
journal of the microelectronics and packaging society
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2014.21.4.033
Subject(s) - delamination (geology) , bending , paint adhesion testing , reliability (semiconductor) , materials science , adhesion , interface (matter) , three point flexural test , test method , composite material , reliability engineering , computer science , mechanical engineering , engineering , capillary action , paleontology , power (physics) , tectonics , physics , quantum mechanics , capillary number , subduction , biology
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