Open AccessSiC based Technology for High Power Electronics and Packaging Applications
Author(s) -
Ashutosh Sharma,
Soon Jae Lee,
Young Joo Jang,
Jae Pil Jung
Publication year - 2014
Publication title -
journal of the microelectronics and packaging society
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2014.21.2.071
Subject(s) - electronics , power electronics , packaging engineering , electronic packaging , electrical engineering , materials science , engineering physics , engineering , manufacturing engineering , mechanical engineering , voltage
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