Open AccessOverview on Thermal Management Technology for High Power Device Packaging
Author(s) -
Kwang-Seok Kim,
Don-Hyun Choi,
SeungBoo Jung
Publication year - 2014
Publication title -
journal of the microelectronics and packaging society
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2014.21.2.013
Subject(s) - thermal management of electronic devices and systems , power (physics) , thermal , electrical engineering , engineering , mechanical engineering , physics , quantum mechanics , meteorology
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