Open AccessOverview on Thermal Management Technology for High Power Device Packaging
Author(s) -
KwangSeok Kim,
Don-Hyun Choi,
SeungBoo Jung
Publication year - 2014
Publication title -
maikeuro jeonja mit paekijing hakoeji/ma'ikeu'ro jeonja mic pae'kijing haghoeji
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2014.21.2.013
Subject(s) - thermal management of electronic devices and systems , power (physics) , thermal , electrical engineering , engineering , mechanical engineering , physics , quantum mechanics , meteorology