Open AccessFlip Chip Process on CNT-Ag Composite Pads for Stretchable Electronic Packaging
Author(s) -
Jung Yeol Choi,
Tae Sung Oh
Publication year - 2013
Publication title -
journal of the microelectronics and packaging society
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2013.20.4.017
Subject(s) - flip chip , materials science , composite number , contact resistance , substrate (aquarium) , composite material , chip , omega , adhesive , layer (electronics) , telecommunications , computer science , oceanography , physics , quantum mechanics , geology
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