Open AccessNumerical Analysis for Thermal-deformation Improvement in TSOP(Thin Small Outline Package) by Anti-deflection Adhesives
Author(s) -
SangWoo Kim,
Hai-Joong Lee,
Hyo-Soo Lee
Publication year - 2013
Publication title -
journal of the microelectronics and packaging society
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2013.20.3.031
Subject(s) - lead frame , deflection (physics) , ball grid array , materials science , flip chip , adhesive , structural engineering , wire bonding , quad flat no leads package , thermal , electronic packaging , thermal expansion , composite material , chip , mechanical engineering , soldering , semiconductor device , engineering , electrical engineering , optics , physics , layer (electronics) , meteorology
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