Open AccessBonding Strength of Cu/SnAgCu Joint Measured with Thermal Degradation of OSP Surface Finish
Author(s) -
Won-Sik Hong,
Jae-Seong Jung,
Chulmin Oh
Publication year - 2012
Publication title -
journal of the microelectronics and packaging society
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2012.19.1.047
Subject(s) - joint (building) , degradation (telecommunications) , materials science , thermal , surface roughness , metallurgy , composite material , structural engineering , engineering , electronic engineering , thermodynamics , physics
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