Open AccessLow Temperature bonding Technology for Electronic Packaging
Author(s) -
Sun-Chul Kim,
Youngh-Ho Kim
Publication year - 2012
Publication title -
journal of the microelectronics and packaging society
Language(s) - Uncategorized
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2012.19.1.017
Subject(s) - flip chip , soldering , interconnection , materials science , microelectronics , electronic packaging , melting temperature , melting point , reflow soldering , tin , diffusion bonding , adhesive , composite material , metallurgy , optoelectronics , layer (electronics) , computer science , computer network
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