Open AccessReview of Technology Development of High Heat Dissipative Insulating Sheet
Author(s) -
MyongJae Yoo,
SeongDae Park,
Ho-Sun Lim,
Woosung Lee
Publication year - 2012
Publication title -
journal of the microelectronics and packaging society
Language(s) - English
Resource type - Journals
eISSN - 2287-7525
pISSN - 1226-9360
DOI - 10.6117/kmeps.2012.19.1.009
Subject(s) - dissipative system , dissipation , thermal management of electronic devices and systems , materials science , high heat , electronics , mechanical engineering , engineering physics , electrical engineering , engineering , thermodynamics , composite material , physics
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