Open AccessThe removal of saw marks on diamond wire-sawn single crystalline silicon wafers
Author(s) -
Kyoung Hee Lee
Publication year - 2016
Publication title -
han-guk gyeoljeong seongjang hakoeji/han'gug gyeoljeong seongjang haghoeji
Language(s) - English
Resource type - Journals
eISSN - 2234-5078
pISSN - 1225-1429
DOI - 10.6111/jkcgct.2016.26.5.171
Subject(s) - wafer , diamond , materials science , silicon , slicing , ammonium hydroxide , metallurgy , composite material , optoelectronics , mechanical engineering , engineering , chemical engineering