Open AccessExperimental Study on the Thermal Performance of a Printed Circuit Heat Exchanger in a Cryogenic Environment
Author(s) -
Dong Ho Kim,
Sang-Jun Na,
Young Kim,
Jihun Choi,
Seok Ho Yoon
Publication year - 2015
Publication title -
seolbi gonghak nonmunjip/seolbi gonghag nonmunjib
Language(s) - English
Resource type - Journals
eISSN - 2465-7611
pISSN - 1229-6422
DOI - 10.6110/kjacr.2015.27.8.426
Subject(s) - printed circuit board , heat exchanger , materials science , heat transfer , cryogenics , liquid nitrogen , pressure drop , nuclear engineering , diffusion bonding , composite material , mechanical engineering , thermodynamics , electrical engineering , chemistry , engineering , physics , organic chemistry