Open AccessScanning electron microscope examination of wire bonds from high-reliability devices
Author(s) -
K. O. Leedy
Publication year - 1973
Language(s) - English
Resource type - Reports
DOI - 10.6028/nbs.tn.785
Subject(s) - scanning electron microscope , reliability (semiconductor) , materials science , electron microscope , nanotechnology , environmental scanning electron microscope , computer science , optics , composite material , physics , thermodynamics , power (physics)