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A wafer chuck for use between -196 and 350 degrees C
Author(s) -
R. Y. Koyama,
M. G. Buehler
Publication year - 1979
Language(s) - English
Resource type - Reports
DOI - 10.6028/nbs.sp.400-55
Subject(s) - wafer , engineering drawing , engineering , computer science , materials science , nanotechnology

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