Open AccessAdvances in Pretreatments for Electroless Copper Plating on Polymer Materials
Author(s) -
Anni Zheng,
Lei Jin,
Jiaqiang Yang,
Weiqing Li,
Zhaoyun Wang,
FangZu Yang,
Dongping Zhan,
ZhongQun Tian
Publication year - 2022
Publication title -
acta chimica sinica
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.565
H-Index - 40
ISSN - 0567-7351
DOI - 10.6023/a22010026
Subject(s) - chemistry , copper , copper plating , polymer , chemical engineering , metallurgy , organic chemistry , electroplating , materials science , layer (electronics) , engineering
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