Open AccessStudy Of Quality And Reliability Of Welding Process Reflow Component Technology BGA
Author(s) -
Robson Marques Costa,
Jandecy Cabral Leite,
Antônio da Silva Vieira,
Raimundo Valdan Pereira Lopes,
Roberto Tetsuo Fujiyama
Publication year - 2015
Publication title -
itegam-jetia
Language(s) - English
Resource type - Journals
ISSN - 2447-0228
DOI - 10.5935/2447-0228.20150005
Subject(s) - reliability (semiconductor) , component (thermodynamics) , ball grid array , reliability engineering , welding , process (computing) , quality (philosophy) , manufacturing engineering , computer science , materials science , soldering , engineering , metallurgy , power (physics) , physics , philosophy , epistemology , quantum mechanics , thermodynamics , operating system