Open AccessConfiguration design of die and plug to improve bonding strength between materials in cold drawing process of multi-layered pipes
Author(s) -
Hyeok Choi,
Mok-Tan Ahn,
Seong-Hun Ha,
Joon-Hong Park
Publication year - 2020
Publication title -
han-guk marin enjinieoring hakoeji
Language(s) - English
Resource type - Journals
eISSN - 2234-8352
pISSN - 2234-7925
DOI - 10.5916/jamet.2020.44.2.139
Subject(s) - die (integrated circuit) , cold forming , process (computing) , materials science , bonding strength , mechanical engineering , engineering , structural engineering , composite material , computer science , operating system