Open AccessA non-linear analytic stress model for the analysis on the stress interaction between TSVs
Author(s) -
Ming-Han Liao,
Shih-Han Kao,
Sung-Jie Huang
Publication year - 2015
Publication title -
international journal of automation and smart technology
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.148
H-Index - 10
ISSN - 2223-9766
DOI - 10.5875/ausmt.v5i2.323
Subject(s) - superposition principle , materials science , stress (linguistics) , delamination (geology) , thermal expansion , finite element method , nonlinear system , copper , silicon , work (physics) , through silicon via , dielectric , composite material , mechanics , structural engineering , mathematical analysis , mechanical engineering , optoelectronics , engineering , physics , mathematics , metallurgy , paleontology , philosophy , linguistics , quantum mechanics , biology , subduction , tectonics