Open AccessImprovement of Solder Joint Strength in SAC 305 Solder Ball to ENIG Substrate Using LF Hydrogen Radical Treatment
Author(s) -
Ahreum Lee,
Seung-Jae Jo,
Jai-Hyun Park,
Chung-Yun Kang
Publication year - 2011
Publication title -
journal of welding and joining
Language(s) - English
Resource type - Journals
eISSN - 2287-8955
pISSN - 1225-6153
DOI - 10.5781/kwjs.2011.29.1.099
Subject(s) - soldering , materials science , composite material , ball (mathematics) , joint (building) , shear strength (soil) , microstructure , metallurgy , structural engineering , mathematical analysis , environmental science , mathematics , soil science , engineering , soil water
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