Open AccessElectrical Characterization of Electronic Package
Author(s) -
JongWoong Kim,
JaMyeong Koo,
JeongWon Yoon,
BoIn Noh,
Seung-Boo Jung
Publication year - 2008
Publication title -
journal of welding and joining
Language(s) - English
Resource type - Journals
eISSN - 2287-8955
pISSN - 1225-6153
DOI - 10.5781/kwjs.2008.26.1.017
Subject(s) - characterization (materials science) , materials science , computer science , nanotechnology
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom