Open AccessBehavior Analysis of Bakery Die
Author(s) -
Jong-Sun Lee
Publication year - 2008
Publication title -
journal of the korea academia-industrial cooperation society
Language(s) - English
Resource type - Journals
eISSN - 2288-4688
pISSN - 1975-4701
DOI - 10.5762/kais.2008.9.6.1506
Subject(s) - die (integrated circuit) , finite element method , deformation (meteorology) , engineering , engineering drawing , mechanical engineering , structural engineering , computer science , materials science , composite material
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