Open AccessA Study on the Thermal Oxidation and Wettability of Lead-free Solders of Sn-Ag-Cu and Sn-Ag-Cu-In
Author(s) -
Hyunbok Lee,
Sang Wan Cho
Publication year - 2014
Publication title -
applied science and convergence technology
Language(s) - English
Resource type - Journals
eISSN - 2288-6559
pISSN - 1225-8822
DOI - 10.5757/asct.2014.23.6.345
Subject(s) - soldering , wetting , materials science , metallurgy , alloy , x ray photoelectron spectroscopy , layer (electronics) , coating , solderability , composite material , chemical engineering , engineering
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