Open AccessA Study on the Adhesion Improvement of Immersion Copper Coatings using Complexing Agent
Author(s) -
Seokbon Koo,
Jumi Jeon,
Jaehyun Hur,
Hong-Kee Lee
Publication year - 2015
Publication title -
han-gug pyomyeon geumsog hag-hoe/han-guk pyomyeon gonghak hoeji
Language(s) - English
Resource type - Journals
eISSN - 2288-8403
pISSN - 1225-8024
DOI - 10.5695/jkise.2015.48.1.001
Subject(s) - copper , immersion (mathematics) , coating , adhesion , chelation , amino acid , layer (electronics) , copper sulfate , chemistry , materials science , alloy , copper plating , metallurgy , nuclear chemistry , organic chemistry , biochemistry , electroplating , mathematics , pure mathematics