Open AccessEvaluation of ENEPIG Surface Treatment for High-reliability PCB in Mobile Module
Author(s) -
Lee joonkyun,
Young-Min Yim,
Jung H. Seo
Publication year - 2010
Publication title -
han-gug pyomyeon geumsog hag-hoe/han-guk pyomyeon gonghak hoeji
Language(s) - English
Resource type - Journals
eISSN - 2288-8403
pISSN - 1225-8024
DOI - 10.5695/jkise.2010.43.3.142
Subject(s) - reliability (semiconductor) , materials science , soldering , wetting , chip scale package , surface finish , metallurgy , optoelectronics , composite material , wafer , power (physics) , physics , quantum mechanics