Open AccessEvaluation of ENEPIG Surface Treatment for High-reliability PCB in Mobile Module
Author(s) -
Joon-Kyun Lee,
Young-Min Yim,
JunHo Seo
Publication year - 2010
Publication title -
journal of the korean institute of surface engineering
Language(s) - English
Resource type - Journals
eISSN - 2288-8403
pISSN - 1225-8024
DOI - 10.5695/jkise.2010.43.3.142
Subject(s) - reliability (semiconductor) , materials science , soldering , wetting , chip scale package , surface finish , metallurgy , optoelectronics , composite material , wafer , power (physics) , physics , quantum mechanics
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