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Rentang Modulus dari Thin Layer yang Menunjukkan Kondisi Bonding Antar Lapisan Beraspal
Author(s) -
Eri Susanto Hariyadi
Publication year - 2010
Publication title -
jurnal teknik sipil
Language(s) - Uncategorized
Resource type - Journals
eISSN - 2549-2659
pISSN - 0853-2982
DOI - 10.5614/jts.2006.13.4.3
Subject(s) - physics , composite material , materials science

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