Open AccessFormulation design of a new type of epoxy resin-based insulating adhesive and research on its high temperature resistance
Author(s) -
Bin Tang,
Longfei Zhang,
Qing Quan Liang,
Zongchang Luo,
Chuansheng Luo,
Jialin Wang,
Mengzhu Hu,
Liping Zhu
Publication year - 2022
Publication title -
advances in engineering technology research
Language(s) - English
Resource type - Journals
ISSN - 2790-1688
DOI - 10.56028/aetr.2.1.61
Subject(s) - epoxy , materials science , adhesive , composite material , curing (chemistry) , layer (electronics)