Open AccessPhysicochemical Properties and Antibacterial Activity of Nanostructured Copper Electrodeposited on Stainless Steel Surface
Publication year - 2022
Publication title -
malaysian journal of chemistry/malaysian journal of chemistry
Language(s) - English
Resource type - Journals
eISSN - 2550-1658
pISSN - 1511-2292
DOI - 10.55373/mjchem.v24i1.1254
Subject(s) - copper , materials science , coating , wetting , metallurgy , contact angle , antibacterial activity , dissolution , adhesion , surface roughness , chemical engineering , composite material , bacteria , biology , engineering , genetics