Open AccessTHE ADVANTAGES OF EVAPORATION IN MICRO-SCALE CHANNELS TO COOL MICROELETRONIC DEVICES
Author(s) -
Gherhardt Ribatski,
Luben CabezasGómez,
Hélio Aparecido Navarro,
José Maria Saíz-Jabardo
Publication year - 2007
Publication title -
engenharia térmica
Language(s) - English
Resource type - Journals
ISSN - 1676-1790
DOI - 10.5380/reterm.v6i2.61688
Subject(s) - heat sink , boiling , sink (geography) , thermal management of electronic devices and systems , electronics , thermal , evaporation , power density , environmental science , process engineering , materials science , mechanical engineering , engineering physics , computer science , electrical engineering , engineering , power (physics) , thermodynamics , physics , cartography , geography
In this paper, the importance of the development of new high power density thermal management systems for electronic devices is assessed. It is described the new heat sink technologies under development to be used in the cooling of microprocessors. The main difficulties to be overcome before the spreading of one specific heat sink configuration are identified. At the end, it is concluded that a heat sink based on flow boiling in micro-scale channels is the most promising approach.