Open AccessCOMPARISON BETWEEN SINGLE AND DOUBLE INTEGRAL TRANSFORMATION SOLUTIONS OF HEAT CONDUCTION IN SOLID-STATE ELECTRONICS
Author(s) -
Lívia M. Corrêa,
Daniel Chalhub
Publication year - 2019
Publication title -
engenharia térmica
Language(s) - English
Resource type - Journals
ISSN - 1676-1790
DOI - 10.5380/reterm.v18i2.70795
Subject(s) - thermal conduction , electronics , transformation (genetics) , work (physics) , field (mathematics) , mathematics , domain (mathematical analysis) , integral transform , mechanical engineering , mathematical analysis , electronic engineering , electrical engineering , engineering , thermodynamics , physics , chemistry , pure mathematics , biochemistry , gene
The design of modern electronic devices has been dealing with challenges on thermal control. In this work, it is proposed two different ways of modeling the temperature field in Solid State Electronics (SSE) using integral transforms, with several heat generations in the domain of the microchip and external convection. Two proposed approaches solve the heat conduction formulation on the SSE using the Classical Integral Transform Technique (CITT): One performing a single transformation (CITT-ST) and the other performing a double transformation (CITT-DT). Both methodologies are compared and achieved similar results. The simpler analytical solution by CITT-DT contrasts with a complex and cumbersome analytical manipulation of CITT-ST. The results show that CITT-ST is more efficient to obtain the solution, requiring a lower truncation order, for the problem of heat conduction in Solid State Electronics even though it has a more complex formulation.