Open AccessAdhesive bonding using thick polymer film of SU-8 photoresist for wafer level package
Author(s) -
Kyoung-Hwan Na,
Ill-Hwan Kim,
Eun-Sung Lee,
HyeonCheol Kim,
Kukjin Chun
Publication year - 2007
Publication title -
journal of sensor science and technology
Language(s) - English
Resource type - Journals
eISSN - 2093-7563
pISSN - 1225-5475
DOI - 10.5369/jsst.2007.16.5.325
Subject(s) - photoresist , adhesive , wafer , materials science , composite material , wafer bonding , polymer , wafer level packaging , adhesive bonding , optoelectronics , layer (electronics)
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