Open AccessDesign and fabrication of condenser microphone with rigid backplate and vertical acoustic holes using DRIE and wafer bonding technology
Author(s) -
Hyu-Sang Kwon,
Kwang-Cheol Lee
Publication year - 2007
Publication title -
journal of sensor science and technology
Language(s) - English
Resource type - Journals
eISSN - 2093-7563
pISSN - 1225-5475
DOI - 10.5369/jsst.2007.16.1.062
Subject(s) - materials science , deep reactive ion etching , wafer , bulk micromachining , microphone , microelectromechanical systems , electrode , silicon , silicon nitride , air gap (plumbing) , etching (microfabrication) , optoelectronics , surface micromachining , electrical engineering , composite material , layer (electronics) , fabrication , reactive ion etching , chemistry , engineering , medicine , alternative medicine , pathology , loudspeaker
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